-Standardize components, and reduce the number of parts -Assembly automation, and simplify assembly process -Simplify the design, and shorten the time to market -Expandable architecture, to increase the market coverage
120W Dual Type-C Solution
Modular Solutions
SiP Packaging Technology
-High frequency circuit to increase power density -Molding package to reduce the safety spacing requirement -Internal filling to increase thermal conductivity -Flattened surface to enhance the heat dissipation capability
AI Accelerator Power Solution
Modular High-Power-Density EV Charging Solution
MTPIPM
MTPIPM
Customized Packaging and Development Process
Housing Type
Process Development
Double Side Molding
3D Packaging
Embedded Packaging
Packaging Type
Development Process
Customer Spec and Kick-Off
Product Design and Development
Process Development
Production Development and Release
Production and Deliver
Provide customers with high-quality customized services
Understand customer needs from system value perspective
Professional and optimized solution
Flexible packaging technology platform
Rigorous and efficient development process and quality system
Shanghai MetaPWR Electronics Co., Ltd.
Company Tel: 021-58188077 Company Email: public@metapwr.com.cn Company address: 1&2F, Building 11, Lane 218, Haiji 6th Road, Nanhui New Town, Pudong New Area, Shanghai
